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1. general description the 74aup1g3208 provides the boolean function: y = (a + b) c. the user can choose the logic functions or, and and or-and. all inputs can be connected to v cc or gnd. schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 0.8 v to 3.6 v. this device ensures a very low static and dynamic power consumption across the entire v cc range from 0.8 v to 3.6 v. this device is fully specified for pa rtial power-down ap plications using i off . the i off circuitry disables the output, preventin g the damaging backflow current through the device when it is powered down. 2. features and benefits ? wide supply voltage range from 0.8 v to 3.6 v ? high noise immunity ? complies with jedec standards: ? jesd8-12 (0.8 v to 1.3 v) ? jesd8-11 (0.9 v to 1.65 v) ? jesd8-7 (1.2 v to 1.95 v) ? jesd8-5 (1.8 v to 2.7 v) ? jesd8-b (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f class 3a exceeds 5000 v ? mm jesd22-a115-a exceeds 200 v ? cdm jesd22-c101e exceeds 1000 v ? low static power consumption; i cc = 0.9 a (maximum) ? latch-up performance exceeds 100 ma per jesd 78 class ii ? inputs accept voltages up to 3.6 v ? low noise overshoot and undershoot < 10 % of v cc ? i off circuitry provides partial power-down mode operation ? multiple package options ? specified from ? 40 cto+85 c and ? 40 cto+125 c 74aup1g3208 low-power 3-input or-and gate rev. 3 ? 11 october 2010 product data sheet
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 2 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74AUP1G3208GW ? 40 c to +125 c sc-88 plastic surface-mounted package; 6 leads sot363 74aup1g3208gm ? 40 c to +125 c xson6 plastic extremely thin sm all outline package; no leads; 6 terminals; body 1 1.45 0.5 mm sot886 74aup1g3208gf ? 40 c to +125 c xson6 plastic extremely thin sm all outline package; no leads; 6 terminals; body 1 1 0.5 mm sot891 74aup1g3208gn ? 40 c to +125 c xson6 extremely thin small outline package; no leads; 6 terminals; body 0.9 1.0 0.35 mm sot1115 74aup1g3208gs ? 40 c to +125 c xson6 extremely thin small outline package; no leads; 6 terminals; body 1.0 1.0 0.35 mm sot1202 table 2. marking type number marking code [1] 74AUP1G3208GW a2 74aup1g3208gm a2 74aup1g3208gf a2 74aup1g3208gn a2 74aup1g3208gs a2 fig 1. logic symbol 001aad5 01 1 3 6 a b c 4 y
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 3 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level. fig 2. pin configuration sot363 fig 3. pin config uration sot886 fig 4. pin configuration sot891, sot1115 and sot1202 74aup1g3208 ac gnd by 001aad500 1 2 3 6 v cc 5 4 74aup1g3208 gnd 001aad507 a b v cc c y transparent top view 2 3 1 5 4 6 74aup1g3208 gnd 001aad506 a b v cc c y transparent top view 2 3 1 5 4 6 table 3. pin description symbol pin description a 1 data input a gnd 2 ground (0 v) b 3 data input b y 4 data output y v cc 5 supply voltage c 6 data input c table 4. function table [1] input output c b a y llll llhl lhll lhhl hl l l hl hh hhl h hhhh
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 4 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 7.1 logic configurations 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for sc-88 packages: above 87.5 c the value of p tot derates linearly with 4.0 mw/k. for xson6 packages: above 118 c the value of p tot derates linearly with 7.8 mw/k. table 5. function selection table logic function figure 2-input and see figure 5 and figure 6 2-input or see figure 7 3-input gate with the boolean function: y = (a + b) c see figure 8 fig 5. 2-input and gate fig 6. 2-input and gate 001aad50 2 1 2 3 6 5 4 b b c c v cc y y 001aad50 3 1 2 3 6 5 4 a a c c v cc y y fig 7. 2-input or gate fig 8. 3-input gate with the boolean function: y=(a+b) c 001aad50 4 1 2 3 6 5 4 a a b b v cc y y 001aad50 5 1 2 3 6 5 4 a a b b c v cc y y c table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v i ik input clamping current v i <0v ? 50 - ma v i input voltage [1] ? 0.5 +4.6 v i ok output clamping current v o <0v ? 50 - ma v o output voltage active mode and power-down mode [1] ? 0.5 +4.6 v i o output current v o =0 vtov cc - 20 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 c p tot total power dissipation t amb = ? 40 c to +125 c [2] -250mw
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 5 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 9. recommended operating conditions 10. static characteristics table 7. recommended operating conditions symbol parameter conditions min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage active mode 0 v cc v power-down mode; v cc =0v 0 3.6 v t amb ambient temperature ? 40 +125 c t/ v input transition rise and fall rate v cc = 0.8 v to 3.6 v 0 200 ns/v table 8. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = 25 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.75 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.11 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.32 - - v i o = ? 2.3 ma; v cc = 2.3 v 2.05 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.9 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.72 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.6 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.31 v i o = 1.9 ma; v cc = 1.65 v - - 0.31 v i o = 2.3 ma; v cc = 2.3 v - - 0.31 v i o = 3.1 ma; v cc = 2.3 v - - 0.44 v i o = 2.7 ma; v cc = 3.0 v - - 0.31 v i o = 4.0 ma; v cc = 3.0 v - - 0.44 v
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 6 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.1 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.2 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc =0vto0.2v -- 0.2 a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --0.5 a i cc additional supply current v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v --40 a c i input capacitance v cc = 0 v to 3.6 v; v i = gnd or v cc -0.8-pf c o output capacitance v o = gnd; v cc = 0 v - 1.7 - pf t amb = ? 40 c to +85 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.7 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.03 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.30 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.97 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.85 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.67 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.55 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.37 v i o = 1.9 ma; v cc = 1.65 v - - 0.35 v i o = 2.3 ma; v cc = 2.3 v - - 0.33 v i o = 3.1 ma; v cc = 2.3 v - - 0.45 v i o = 2.7 ma; v cc = 3.0 v - - 0.33 v i o = 4.0 ma; v cc = 3.0 v - - 0.45 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.5 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.5 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc =0vto0.2v -- 0.6 a table 8. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 7 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --0.9 a i cc additional supply current v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v --50 a t amb = ? 40 c to +125 c v ih high-level input voltage v cc = 0.8 v 0.75 v cc -- v v cc = 0.9 v to 1.95 v 0.70 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.25 v cc v v cc = 0.9 v to 1.95 v - - 0.30 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.11 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.6 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 0.93 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.17 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.77 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.67 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.40 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.30 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.11 v i o = 1.1 ma; v cc = 1.1 v - - 0.33 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.41 v i o = 1.9 ma; v cc = 1.65 v - - 0.39 v i o = 2.3 ma; v cc = 2.3 v - - 0.36 v i o = 3.1 ma; v cc = 2.3 v - - 0.50 v i o = 2.7 ma; v cc = 3.0 v - - 0.36 v i o = 4.0 ma; v cc = 3.0 v - - 0.50 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.75 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.75 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc =0vto0.2v -- 0.75 a i cc supply current v i = gnd or v cc ; i o = 0 a; v cc = 0.8 v to 3.6 v --1.4 a i cc additional supply current v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v --75 a table 8. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 8 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 11. dynamic characteristics table 9. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) c l = 5 pf t pd propagation delay a, b or c to y; see figure 9 [2] v cc = 0.8 v - 18.5 - - - - ns v cc = 1.1 v to 1.3 v 2.2 5.4 10.6 2.2 10.9 11.1 ns v cc = 1.4 v to 1.6 v 1.9 3.8 6.4 1.8 6.9 7.2 ns v cc = 1.65 v to 1.95 v 1.5 3.1 5.1 1.4 5.6 5.9 ns v cc = 2.3 v to 2.7 v 1.3 2.4 3.7 1.2 4.1 4.4 ns v cc = 3.0 v to 3.6 v 1.2 2.2 3.2 1.1 3.4 3.6 ns c l = 10 pf t pd propagation delay a, b or c to y; see figure 9 [2] v cc = 0.8 v - 22.1 - ns v cc = 1.1 v to 1.3 v 2.6 6.3 12.4 2.5 12.8 13.1 ns v cc = 1.4 v to 1.6 v 2.3 4.4 7.4 2.1 8.0 8.4 ns v cc = 1.65 v to 1.95 v 2.0 3.6 5.9 1.8 6.4 6.8 ns v cc = 2.3 v to 2.7 v 1.7 3.0 4.4 1.6 4.8 5.1 ns v cc = 3.0 v to 3.6 v 1.6 2.7 3.9 1.4 4.2 4.4 ns c l = 15 pf t pd propagation delay a, b or c to y; see figure 9 [2] v cc = 0.8 v - 25.6 - - - - ns v cc = 1.1 v to 1.3 v 3.0 7.1 14.1 2.8 14.6 14.9 ns v cc = 1.4 v to 1.6 v 2.6 5.0 8.4 2.4 9.1 9.5 ns v cc = 1.65 v to 1.95 v 2.2 4.1 6.7 2.1 7.4 7.8 ns v cc = 2.3 v to 2.7 v 2.0 3.4 5.0 1.9 5.5 5.9 ns v cc = 3.0 v to 3.6 v 1.9 3.2 4.5 1.7 4.8 5.0 ns c l = 30 pf t pd propagation delay a, b or c to y; see figure 9 [2] v cc = 0.8 v - 34.1 - - - - ns v cc = 1.1 v to 1.3 v 3.9 9.3 18.9 3.7 19.7 20.1 ns v cc = 1.4 v to 1.6 v 3.4 6.5 11.0 3.2 12.1 12.7 ns v cc = 1.65 v to 1.95 v 3.0 5.4 8.9 2.9 9.7 10.3 ns v cc = 2.3 v to 2.7 v 2.8 4.5 6.5 2.6 7.1 7.5 ns v cc = 3.0 v to 3.6 v 2.6 4.3 5.8 2.4 6.4 6.7 ns
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 9 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] all specified values are the avera ge typical values over all stated loads. [4] c pd is used to determine the dynamic power dissipation (p d in w). p d =c pd v cc 2 f i n+ (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; (c l v cc 2 f o ) = sum of the outputs. 12. waveforms c l = 5 pf, 10 pf, 15 pf and 30 pf c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [3] [4] v cc = 0.8 v - 2.6 - - - - pf v cc = 1.1 v to 1.3 v - 2.7 - - - - pf v cc = 1.4 v to 1.6 v - 2.8 - - - - pf v cc = 1.65 v to 1.95 v - 3.0 - - - - pf v cc = 2.3 v to 2.7 v - 3.5 - - - - pf v cc = 3.0 v to 3.6 v - 4.0 - - - - pf table 9. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 10 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) measurement points are given in table 10 . v ol and v oh are typical output voltage levels that occur with the output load. fig 9. input a, b and c to output y propagation delay times y output a, b, c input y output gnd v i v oh v oh v ol v ol v m v m v m v m v m v m t plh t plh t phl t phl 001aab59 3
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 10 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate [1] for measuring enable and disable times r l = 5 k , for measuring propagation delays, setup and hold times and pulse width r l = 1 m . table 10. measurement points supply voltage output input v cc v m v m v i t r = t f 0.8 v to 3.6 v 0.5 v cc 0.5 v cc v cc 3.0 ns test data is given in table 11 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 10. test circuit for measuring switching times 001aac52 1 dut r t v i v o v ext v cc r l 5 k c l g table 11. test data supply voltage load v ext v cc c l r l [1] t plh , t phl t pzh , t phz t pzl , t plz 0.8 v to 3.6 v 5 pf, 10 pf, 15 pf and 30 pf 5 k or 1 m open gnd 2 v cc
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 11 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 13. package outline fig 11. package outline sot363 (sc-88) references outline version european projection issue date iec jedec jeita sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 6 plastic surface-mounted package; 6 leads sot36 3 unit a 1 max b p cd e e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 04-11-08 06-03-16
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 12 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate fig 12. package outline sot886 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot88 6 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 13 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate fig 13. package outline sot891 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot891 sot89 1 05-04-06 07-05-15 xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale dimensions (mm are the original dimensions) unit mm 0.20 0.12 1.05 0.95 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.35 0.55 a max 0.5 0.04 1 6 2 5 3 4 a 6 (1) 4 (1) note 1. can be visible in some manufacturing processes.
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 14 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate fig 14. package outline sot1115 (xson6) references outline version european projection issue date iec jedec jeita sot1115 sot1115_po 10-04-02 10-04-07 unit mm max nom min 0.35 0.04 0.95 0.90 0.85 1.05 1.00 0.95 0.55 0.3 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. x son6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm sot111 5 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4 ) (2) e 1 e 1 e l l 1 b 3 2 1 6 5 4 (6 ) (2) a 1 a
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 15 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate fig 15. package outline sot1202 (xson6) references outline version european projection issue date iec jedec jeita sot1202 sot1202_po 10-04-02 10-04-06 unit mm max nom min 0.35 0.04 1.05 1.00 0.95 1.05 1.00 0.95 0.55 0.35 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. x son6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm sot120 2 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area d e (4 ) (2) e 1 e 1 e l b 123 l 1 6 5 4 (6 ) (2) a a 1
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 16 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 14. abbreviations 15. revision history table 12. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model mm machine model table 13. revision history document id release date data sheet status change notice supersedes 74aup1g3208 v.3 20101011 product data sheet - 74aup1g3208 v.2 modifications: ? added type number 74aup1g3208gn (sot1115/xson6 package). ? added type number 74aup1g3208gs (sot1202/xson6 package). 74aup1g3208 v.2 20090703 product data sheet - 74aup1g3208 v.1 74aup1g3208 v.1 20061129 product data sheet - -
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 17 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
74aup1g3208 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 11 october 2010 18 of 19 nxp semiconductors 74aup1g3208 low-power 3-input or-and gate export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74aup1g3208 low-power 3-input or-and gate ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 11 october 2010 document identifier: 74aup1g3208 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 7.1 logic configurations . . . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 17 contact information. . . . . . . . . . . . . . . . . . . . . 18 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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